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Product details

Product Overview:

Whenever a BGA component is removed from an assembly, the attachment balls must be replaced before it can be reused. It's frustrating and very costly to throw away good components that could be recovered with the right tools.

The unavailability of the new BGA components as replacement for damaged ones makes re-balling is the only alternative.

Package content:

JV-RMP4 is a package of BGA Stencils for PS4. Package contains 4 stencils for the following BGAs

  • SCEI (Sony Computer Entertainment, Inc.) CXD90026G SoC
  • SCEI CXD90025G Secondary/Low Power Processor for Network Tasks
  • Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM
  • Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM

Technical specifications:

Technology used to make the stencils

Laser cut

Material used

Stainless Steel

Stencil dimension

73mmx73mm working with JV-JIG only

Stencil thickness

0.30mm and 0.25mm (300 micron and 250 micron)

Aperture tolerance

6.35 micron

PS4 Stencils details:

  • 1.SCEI  CXD90026G SoC package

                 Ball Size 0.55mm

 ps4 stencils details 01  ps4 stencils details 01
  • 2.SCEI CXD90025G Secondary/Low Power Processor for Network Tasks

               Ball Size: 0.40mm

 ps4 stencils details 01  ps4 stencils details 01
  • 3.Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM

                   Ball Size: 0.40mm

 ps4 stencils details 01  ps4 stencils details 01
  • 4.Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM

               Ball Size: 0.40mm

 ps4 stencils details 01  ps4 stencils details 01