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Product details

What are solder balls?

In BGA package, it is the small sphere of solder that provides the contact between the BGA package and the printed circuit board. Also called a "solder bump." This tiny part could be damaged after fabrication of the BGA package, it could produce bad connections due to bad assembly.

What is the role solder balls play in Bga Reballing?

PCB which fails due to bad BGA connections can be repaired either by reflowing, or by removing the chip and cleaning it of solder, replacing and Reballing

The most accurate & economic method to restore the full functionality of BGA Package is Reballing.

Reballing involves, heating the chip until it can be removed from the board, removing the chip, removing solder remaining on the chip and board, putting new BGA solder balls in place and heating the BGA package or board to solder it in place.

The new solder balls can be placed via several methods, including:

* Using a stencil for both spheres and the solder paste or flux
* Using a BGA JIG with embedded balls corresponding to the BGA package  pattern
* Using semi-automated or fully automated machinery.

What does Jovy Systems offer to boost your BGA reballing?

Jovy Systems provides integrated Reballing solution through a combination of high quality stencils, reliable Jig , solder paste and full list of solder spheres.

As we are eager to make your Reballing experience as brilliant as it should be. Jovy Systems come to you with a wide variety of solder balls that are provided in different diameters to meet the majority of rework and repair purposes for the BGA package, also they can fill all standard solder balls requirements like high purity and roundness.

Spheres of each size are provided with minimal tolerances to achieve successful reballing process.

Jovy Solder balls specifications:

Jovy solder balls are provided in many different alloys and manufactured to extremely tight tolerances with exceptional clean surfaces. Moreover Jovy Solder balls combine the advantages of high pureness, accurate diameters and moderate size; typically requested sizes range from 0.25mm to 0.76mm. Packed in plastic jars, each one includes 250'000 balls

  

Alloy

Diameter

 (mm)

Tolerances

+/-  mm

CPK

Spheres / Bottle

63Sn – 37Pb Series

Eutectic composition (183°C)

0.760

0.020

≥ 1.33

250,000

0.650

0.600

0.550

0.015

0.500

0.450

0.400

0.350

0.010

0.300

0.250

96.5Sn –3.5Ag           Series      (221°C)

0.650

0.020

0.600

0.500

0.015

0.450

0.400

0.300

0.010

0.250

 

 

Types of Jovy solder balls:

As a matter of fact the ball attaching process used in the lead-free soldering performance is the same as tin-lead, except the ball attaching temperature profile is approximately 38° C higher. We offer the both types of solder balls the leaded and the lead free to be able to serve all kind of BGA package.

* Lead solder balls: ( SN 63/ PB 37 )
Optimized to offer excellent wetting of leaded component, while the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences.

* Lead free solder balls: (SAC 305 ) ( SN 96.5/ AG 3.0/ CU 0.5)
Ideal to offer excellent wetting of lead free component and board finishes.

Storage and Handling:

Clean and dry environment is required for solder balls storage. Probing of spheres in containers with fingers or other implements can damage the  spheres by changing its shape, scoring its surface or contaminating its surface by skin oils.

Shelf life of all spheres, stored in sealed ESD containers that are not agitated, is 1 year> (12months).

Products are stored in environment below:
Temperature 25 +/- 5 ℃
Humidity 70 +/- 5% RH