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Reballing is renewing the damaged solder ball joints in the IC packages for reworking purposes, rather than using solder paste & stencils method – which depends on expensive material for the BGA stencils and on stencil thickness.

Reballing solution mainly depends on sphere solder balls and BGA stencils to get the most accurate results concerning the methodology of Reballing. Whereas the method of solder paste and stencil mask is used in the mobile phone and part of the PS3 Reballing solutions.

Cost effective, fast process and accurate results are the benefits provided by Jovy Reballing Jigs & Stencils series as a solution for the different types of IC packages Reballing.


Reballing JIG

Standard Stencil Kit

PS3 stencils kit

X-BOX stencils Kit

Universal cellular phone kit

Custom Made stencils

PS4 Stencil

Direct Heating stencils